1. Semiconductor refrigeration
Semiconductor cooling is to use a special semiconductor cooling chip to generate a temperature difference to cool when energized. As long as the heat at the high temperature end can be effectively dissipated, the low temperature end will be continuously cooled. A temperature difference is generated on each semiconductor particle, and a cooling plate is formed by connecting dozens of such particles in series, thereby forming a temperature difference between the two surfaces of the cooling plate. Taking advantage of this temperature difference and cooling the high temperature side with air cooling/water cooling, an excellent heat dissipation effect can be obtained. Semiconductor refrigeration has the advantages of low refrigeration temperature and high reliability. The cold surface temperature can reach minus 10 ℃, but the cost is too high, and it may cause a short circuit due to too low temperature, and the technology of semiconductor refrigeration chips is not mature enough now. practical.
2. Chemical refrigeration
The so-called chemical refrigeration is to use some ultra-low temperature chemical substances, use them to absorb a lot of heat when melting to reduce the temperature. Dry ice and liquid nitrogen are more common in this regard. For example, the use of dry ice can reduce the temperature to below minus 20 degrees Celsius, and some more "abnormal" players use liquid nitrogen to lower the CPU temperature to below minus 100 degrees Celsius (in theory). Of course, due to the high price and the short duration, this The method is more common in the laboratory or extreme overclockers.